Xeon

Intel Xeon Gold 5420+. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR5-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, Supported instruction sets: AMX, SSE4.2, AVX, AVX 2.0, AVX-512. Maximum Enclave Size Support for Intel® SGX: 128 GB, Intel® QuickAssist Technology (QAT): 1 default devices, Intel® Dynamic Load Balancer (DLB): 1 default devices. Processor package size: 77.5 x 56.5 mm

Intel Xeon Gold 5318N. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Intel Xeon BX807133435X. Processor family: Intel Xeon W, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 4000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Use conditions: Workstation, Supported instruction sets: SSE4.1, AMX, SSE4.2, AVX 2.0, AVX-512. Intel® Turbo Boost Max Technology 3.0 frequency: 4.7 GHz, Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz. Package type: Retail box

Intel Xeon PK8071305082000. Processor family: Intel Xeon W, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 4000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Use conditions: Workstation, Supported instruction sets: SSE4.1, AMX, SSE4.2, AVX 2.0, AVX-512. Intel® Turbo Boost Max Technology 3.0 frequency: 4.7 GHz, Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz. Package type: Retail box

Intel Xeon Gold 5418N. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, Supported instruction sets: AMX, SSE4.2, AVX, AVX 2.0, AVX-512. Maximum Enclave Size Support for Intel® SGX: 128 GB, Intel® QuickAssist Technology (QAT): 2 default devices, Intel® Dynamic Load Balancer (DLB): 2 default devices. Processor package size: 77.5 x 56.5 mm

Lenovo Intel Xeon Gold 6338. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB

Lenovo Intel Xeon Gold 6338. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB

Lenovo Intel Xeon Gold 6240. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 4S. Compatibility: ThinkSystem SN550/SN850

Intel Xeon Gold 5320H. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4189, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1146.88 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 4S. Processor package size: 77.5mm x 56.5mm. Maximum internal memory: 1120 GB

Lenovo Intel Xeon Gold 5317. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Maximum internal memory: 6 TB

Lenovo Xeon Silver 4314. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Intel Xeon Gold 6326. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Intel Xeon Gold 5423N. Processor family: Intel® Xeon®, Processor manufacturer: Intel, Processor model: 5423N. Memory channels: Octa-channel, Maximum internal memory supported by processor: 4 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 1S. Maximum Enclave Size Support for Intel® SGX: 128 GB, Intel® QuickAssist Technology (QAT): 0 default devices, Intel® Dynamic Load Balancer (DLB): 0 default devices. Processor package size: 77.5 x 56.5 mm

Cisco Intel Xeon Silver 4314. Processor family: Intel Xeon Silver, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6.14 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Cisco Intel Xeon Silver 4314. Processor family: Intel Xeon Silver, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6.14 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Cisco Intel Xeon Silver 4314. Processor family: Intel Xeon Silver, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6.14 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Intel Xeon Gold 5318Y. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Intel Xeon W-2295. Processor family: Intel Xeon W, Processor socket: LGA 2066 (Socket R4), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 1S. Intel® Turbo Boost Max Technology 3.0 frequency: 4.8 GHz. Processor package size: 45mm x 52.5mm