Processors

AMD Opteron Dual-Core 2216 HE. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

AMD Opteron Dual-core 2216 HE. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

AMD Opteron Dual-Core 280. Processor family: AMD Opteron, Processor socket: Socket 940, Processor lithography: 90 nm

AMD Opteron 4284. Processor family: AMD Opteron, Processor socket: Socket C32, Processor lithography: 32 nm. Market segment: Server. L1 cache: 0.048 MB

AMD Ryzen 7 3700X. Processor family: AMD Ryzen™ 7, Processor socket: Socket AM4, Processor lithography: 7 nm. Memory channels: Dual-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. Market segment: Desktop, PCI Express configurations: 4x16

Lenovo Intel Xeon E5-2630 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S. Compatibility: HPE DL180 Gen9

Lenovo Intel Xeon E5-2630 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S. Compatibility: HPE DL180 Gen9

IBM E5-2620 v2 6C 2.1GHz. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Compatibility: IBM System x3550 M4

Intel Xeon E3-1245V5. Processor family: Intel® Xeon® E3 v5, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. On-board graphics card model: Intel® HD Graphics P530, Maximum on-board graphics card memory: 64 GB, On-board graphics card outputs supported: Embedded DisplayPort (eDP), DisplayPort, HDMI, DVI. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.9 GHz

Intel Core ® ™ i5-12600K Processor (20M Cache, up to 4.90 GHz). Processor family: Intel® Core™ i5, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM,DDR5-SDRAM. On-board graphics card model: Intel UHD Graphics 770, On-board graphics card outputs supported: HDMI 2.1,DisplayPort 1.4a,Embedded DisplayPort (eDP) 1.4b, On-board graphics card base frequency: 300 MHz. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express configurations: 1x16+1x4,2x8+1x4. Package type: Retail box

Lenovo Intel Xeon Bronze 3106. Processor family: Intel Xeon Bronze, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S

Lenovo Intel Xeon Bronze 3106. Processor family: Intel Xeon Bronze, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem ST550

Lenovo Intel Xeon Bronze 3106. Processor family: Intel Xeon Bronze, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S

AMD Opteron 6320. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory types supported by processor: DDR3-SDRAM, Memory clock speeds supported by processor: 1333,1600 MHz. Market segment: Server, Processing Die size: 315 mm². L1 cache: 0.384 MB, Temperature (max): 71.7 °C

AMD Opteron 6320. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory types supported by processor: DDR3-SDRAM, Memory clock speeds supported by processor: 1333,1600 MHz. Market segment: Server, Processing Die size: 315 mm². L1 cache: 0.384 MB, Temperature (max): 71.7 °C

AMD Ryzen 7 5700X. Processor family: AMD Ryzen™ 7, Processor socket: Socket AM4, Processor lithography: 7 nm. Memory channels: Dual-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 2667,2933,3200 MHz. Market segment: Desktop

AMD Ryzen 7 5700X. Processor family: AMD Ryzen™ 7, Processor socket: Socket AM4, Processor lithography: 7 nm. Memory channels: Dual-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 2667,2933,3200 MHz. Market segment: Desktop

Intel Xeon E3-1240V5. Processor family: Intel® Xeon® E3 v5, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.9 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)