Processors

AMD Opteron OS8425PDS6DGN. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 45 nm. Market segment: Server

AMD Opteron Dual-core 8222 SE. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

AMD EPYC Embedded 7352. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Embedded. USB version: 3.2 Gen 1 (3.1 Gen 1)

Cisco Xeon 3.40 GHz E5-2643 v4/135W 6C/20MB

AMD EPYC 7F52. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. Market segment: Server

Lenovo Intel Xeon Gold 6134. Processor family: Intel® Xeon®, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: S4S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR650

AMD EPYC 7443. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. Market segment: Server

Lenovo Xeon Intel Gold 6354. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Cisco E5-2650 v3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 1x4, 1x8, Supported instruction sets: AVX 2.0. Processor package size: 52.5 mm

Cisco Xeon E5-2650 v3 (25M Cache, 2.30 GHz). Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Processor package size: 52.5 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Maximum internal memory: 786432 MB

AMD EPYC 9354P. Processor family: AMD EPYC, Processor socket: Socket SP5, Processor manufacturer: AMD. Memory channels: Dodeca-channel, Memory types supported by processor: DDR5-SDRAM, Memory clock speeds supported by processor: 4800 MHz. Market segment: Server

Intel Xeon Gold 5418Y. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR5-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, Supported instruction sets: AMX, SSE4.2, AVX, AVX 2.0, AVX-512. Maximum Enclave Size Support for Intel® SGX: 128 GB, Intel® Data Streaming Accelerator (DSA): 1 default devices. Package type: Retail box

Lenovo Intel Xeon Gold 6130. Processor family: Intel® Xeon®, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: S4S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SN550

Lenovo Intel Xeon Gold 6130. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: S4S. Processor package size: 76 x 56.5 mm

Lenovo Intel Xeon Gold 6130. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: S4S. Processor package size: 76 x 56.5 mm

AMD Opteron 6386. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory types supported by processor: DDR3-SDRAM, Memory clock speeds supported by processor: 1333,1600 MHz. Market segment: Server, Processing Die size: 315 mm². Temperature (max): 64.4 °C

Lenovo EPYC AMD 7F72. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz, Memory bandwidth (max): 204.8 GB/s. Market segment: Server

Lenovo Xeon Intel Gold 6346. Processor family: Intel® Xeon®, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6.14 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm