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3163504
Intel AXXRMFBU2. Compatibility: Intel RMS25PB080, RMS25PB040, RMT3PB080, RMS25CB080, RMS25CB040, RMT3CB080. Form factor: Battery/RMFBU. Status: Discontinued
4493686
Intel X710-DA2. Internal. Connectivity technology: Wired, Host interface: PCI Express, Interface: Fiber. Maximum data transfer rate: 40000 Mbit/s. Product color: Green, Silver
4959346
Intel AHWBPFABKIT. Product color: Multicolor. Export Control Classification Number (ECCN): EAR99. Packaging content: (1) Dual Port IFT carrier, (4) IFT Cables, (1) sideband cable and (2) Fabric clips. Status: Launched. Product series: I/O Options
4347120
Intel Xeon E3-1225V5. Processor family: Intel® Xeon® E3 v5, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. On-board graphics card model: Intel® HD Graphics P530, Maximum on-board graphics card memory: 64 GB, On-board graphics card outputs supported: Embedded DisplayPort (eDP), DisplayPort, HDMI, DVI. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.7 GHz
5117728
Intel RS3UC080J. Supported storage drive interfaces: SAS, Serial ATA, Host interface: PCI Express x8. RAID levels: JBOD, Data transfer rate: 12 Gbit/s, Form factor: Low Profile MD2 Card. Processor family: LSI. Compatible operating systems: Windows, Linux, VMWare. Packaging content: One Intel RAID Controller RS3UC080J with full and low profile brackets
4347119
Intel Xeon E3-1220V5. Processor family: Intel® Xeon® E3 v5, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.5 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)
